SEMICONDUCTOR POWER MODULES
WE PROVIDE STANDARD AND CUSTOM‑DEVELOPED SEMICONDUCTOR POWER MODULE SOLUTIONS FOR GLOBAL B2B INDUSTRIAL CUSTOMERS. PRODUCT RANGE COVERS IGBT, SIC MOSFET, POWER DIODE, THYRISTOR MODULES, ALONG WITH FULL CUSTOM MODULE PACKAGING SERVICE INCLUDING CHIP‑ON‑DBC SUBSTRATE, CUSTOM HOUSING, PIN‑OUT, ENCAPSULATION AND SAMPLE‑TO‑MASS‑PRODUCTION TECHNICAL SUPPORT FOR INDUSTRIAL DRIVE, RENEWABLE ENERGY, POWER SUPPLY, TRANSPORTATION AND HIGH‑POWER CONVERSION EQUIPMENT.
STANDARD POWER MODULE SERIES
MATURE OFF‑THE‑SHELF POWER MODULE PRODUCTS FOR MAINSTREAM INDUSTRIAL POWER ELECTRONICS APPLICATIONS, MULTIPLE VOLTAGE‑CURRENT SPECS, STANDARD INDUSTRY PACKAGE FOOTPRINT.
- IGBT MODULE: 600V‑1700V RATING, FOR INVERTER, UPS, MOTOR DRIVE
- SIC MOSFET MODULE: HIGH‑VOLTAGE HIGH‑FREQUENCY FOR SOLAR‑STORAGE, EV CHARGER
- POWER DIODE / THYRISTOR MODULE: FOR RECTIFIER, GRID‑CONNECT POWER EQUIPMENT
- COMPATIBLE WITH MAINSTREAM INDUSTRY PACKAGE FOOTPRINT, TECHNICAL DATASHEET SUPPLIED
CUSTOM POWER MODULE DEVELOPMENT
FULL CUSTOM POWER MODULE DEVELOPMENT SERVICE ACCORDING TO CUSTOMER SYSTEM REQUIREMENTS, FROM SPEC EVALUATION, SIMULATION, SUBSTRATE LAYOUT DESIGN, COMPONENT MATCHING, SAMPLE FABRICATION TO RELIABILITY VERIFICATION.
- SPEC REVIEW, THERMAL‑ELECTRICAL SIMULATION AND SCHEME ASSESSMENT
- DBC SUBSTRATE LAYOUT, CHIP PLACEMENT, INTERCONNECTION DESIGN
- CUSTOM BASEPLATE, HOUSING, PIN‑OUT, SILICONE GEL ENCAPSULATION
- SAMPLE PROTOTYPE, PERFORMANCE & RELIABILITY TEST, MASS‑PRODUCTION HANDOVER
MODULE PACKAGING TECHNOLOGY
ADOPT MATURE POWER MODULE PACKAGING PROCESS, INCLUDING DBC DIRECT BONDED COPPER SUBSTRATE, SINTERING / SOLDERING DIE‑ATTACH, AL‑WIRE BONDING, HIGH‑RELIABILITY ENCAPSULATION GEL, METAL / PLASTIC HOUSING ASSEMBLY.
- DBC ALUMINA / ALN CERAMIC SUBSTRATE OPTION
- SINTERING OR HIGH‑QUALITY SOLDER DIE ATTACH PROCESS
- ULTRASONIC ALUMINUM WIRE BONDING INTERCONNECTION
- HIGH‑INSULATION, HIGH‑STABILITY SILICONE GEL ENCAPSULATION
TEST & RELIABILITY VERIFICATION
COMPLETE POWER MODULE TEST AND RELIABILITY VERIFICATION SYSTEM, COVERING ELECTRICAL PARAMETER TEST, INSULATION WITHSTAND‑VOLTAGE, THERMAL RESISTANCE MEASUREMENT, TEMPERATURE CYCLE, POWER‑CYCLING RELIABILITY ASSESSMENT.
- ELECTRICAL PARAMETERS, LEAKAGE CURRENT, FORWARD DROP‑OUT TEST
- WITHSTAND‑VOLTAGE INSULATION TEST, PARTIAL‑DISCHARGE TEST
- THERMAL IMPEDANCE / THERMAL RESISTANCE MEASUREMENT
- TEMPERATURE CYCLE, POWER‑CYCLING RELIABILITY EVALUATION
MAIN APPLICATION AREAS
POWER MODULE PRODUCTS ARE WIDELY USED IN MULTIPLE HIGH‑POWER INDUSTRIAL SCENARIOS FOR OVERSEAS B2B PURCHASERS.
- INDUSTRIAL MOTOR DRIVE, FREQUENCY‑CONVERTER EQUIPMENT
- PHOTOVOLTAIC INVERTER, ENERGY‑STORAGE CONVERTER, UPS POWER SUPPLY
- EV CHARGING STATION, ELECTRIC TRANSPORTATION POWER CONVERSION SYSTEM
- HIGH‑POWER RECTIFIER, GRID‑CONNECTED POWER AND SPECIAL INDUSTRIAL POWER EQUIPMENT
SEND YOUR MODULE PROJECT INQUIRY
SEND US YOUR MODULE SPECIFICATION, RATING REQUIREMENTS OR CUSTOM MODULE DEMAND DOCUMENTS FOR TECHNICAL REVIEW, QUOTATION AND PROJECT SCHEDULE ASSESSMENT.
SEND INQUIRY
